Packaged semiconductor device incorporating heat sink plate

Details Packaged semiconductor device incorporating heat sink plate Packaged semiconductor device incorporating heat sink plate

1995-10-23

1997-09-09

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257712, 257713, 257717, 257782, H01L 2334, H01L 2328

Patent

active

056660030

ABSTRACT:
A packaged semiconductor device is provided which comprises a die pad, a semiconductor chip mounted on the die pad, a plurality of leads electrically connected to the semiconductor chip, a heat sink plate bonded to the die pad opposite to the semiconductor chip, and a resin package enclosing at least the semiconductor chip together with the die pad and a part of each lead. The heat sink plate has a peripheral portion partially overlapping each lead but electrically insulated.

REFERENCES:
patent: 4721995 (1988-01-01), Tanizawa
patent: 4857989 (1989-08-01), Mori et al.
patent: 5430331 (1995-07-01), Hamzehdoost et al.

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