LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated,With specified encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Microelectronic device package filled with liquid or...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Microelectronic package including a polymer encapsulated die

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Micromechanical component having an anodically bonded cap...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Molded plastic package with wire protection

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Molding composition and method, and molded article

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Mounting structure having columnar electrodes and a sealing...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

No-flow underfill composition and method

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Optical semiconductor device and method of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Overhang support for a stacked semiconductor device, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Packaged die on PCB with heat sink encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Packaged semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Packaging integrated circuits for high stress environments

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Packaging structure of SIP and a manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Partial underfill for flip-chip electronic packages

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Passivated nanoparticles, method of fabrication thereof, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Photodetector sealing resin is a boride or an oxide of micro...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Photonic device and process for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Plastic ball grid array assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Plastic molded type electronic device