Plastic ball grid array assembly

Details Plastic ball grid array assembly Plastic ball grid array assembly

2005-03-15

2005-03-15

Eckert, George (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S787000, C257S788000, C257S789000, C257S791000, C257S792000, C257S793000, C257S778000, C438S112000, C438S127000, C361S600000, C361S679090, C029S841000, C029S855000, C174S251000, C264S272110

Reexamination Certificate

active

06867506

ABSTRACT:
An apparatus for enclosing logic chips includes a substrate upon which a logic chip is mounted and a mold cap disposed upon the substrate and covering the logic chip. The mold cap includes at least one extension of sufficient size and shape to provide structural support to a corner section of the substrate.

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