Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1990-11-13
1993-01-19
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
428413, 257793, H01L 2328
Patent
active
051810972
ABSTRACT:
The phenol resin molding composition used in the present invention is obtained by subjecting a resol-type phenol resin to purification until, when the resin is extracted by heating with 10 times the amount of hot water at 120.degree. C. for 100 hours or more, the extract has an electric conductivity of 100 .mu.S/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less, then preparing a composition comprising a resin component consisting of said resol-type phenol resin and a cure rate controlling agent incorporated therewith, optionally incorporating a filler into said composition, kneading the resulting mixture, and then grinding the kneaded mixture. The composition has a good moldability and, when used for resin-sealing of electronic devices or semiconductor devices and transfer-molding of electronic devices using resin, exhibits an excellent adhesive property, electric properties, moisture resistance and heat resistance.
REFERENCES:
patent: 4248920 (1981-02-01), Yoshizumi et al.
patent: 4367318 (1983-01-01), Ishimura et al.
patent: 4596840 (1986-06-01), Hesse et al.
Abe Hidetoshi
Horie Osamu
Ogata Masatsugu
Segawa Masanori
Sugawara Yasuhide
Crane Sara W.
Hitachi , Ltd.
James Andrew J.
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