Method of producing an ultra thin electrically conducting...
Method of providing a vertical interconnect between thin...
Method of reducing electromigration by ordering zinc-doping...
Method of reducing erosion of a metal cap layer during via...
Method of reducing process steps in metal line protective...
Method of titanium/titanium nitride integration
Method of using a polish stop film to control dishing during...
Method of using hydrogen gas in sputter deposition of...
Method of using hydrogen gas in sputter deposition of...
Method to create super secondary grain growth in narrow...
Method to encapsulate copper plug for interconnect...
Method to fabricate aligned dual damascene openings
Method to fabricate aligned dual damascene openings
Method to form very a fine pitch solder bump using methods...
Method to generate porous organic dielectric
Method to increase electromigration resistance of copper...
Method to increase mechanical fracture robustness of porous...
Method to increase mechanical fracture robustness of porous...
Method to obtain a low resistivity and conformity chemical...
Method to selectively cap interconnects with indium or tin...