Electroplated copper interconnection structure, process for...
Electroplated CoWP composite structures as copper barrier...
Electroplated solder terminal
Elimination of residual materials in a multiple-layer interconne
Elimination of thermal deformation in electronic structures
Elimination of thermal deformation in electronic structures
Elongated bonding pad for wire bonding and sort probing
Embedded barrier for dielectric encapsulation
Embedded electroconductive layer structure
Embedded microelectronic capacitor incorporating ground...
Embedded power and ground plane structure
Encapsulated damascene with improved overlayer adhesion
Encapsulated electronic component having a plurality of connecti
Encapsulated metal structures for semiconductor devices and...
Endcap reservoir to reduce electromigration
Enhanced barrier liner formation for via
Enhanced electromigration lifetime of metal interconnection line
Enhanced mechanical strength via contacts
Enhancement of an interconnect
Enhancement of carrier concentration in As-containing layers