Enhanced mechanical strength via contacts

Details Enhanced mechanical strength via contacts Enhanced mechanical strength via contacts

2006-05-18

2008-10-21

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S734000, C257S750000, C257S762000

Reexamination Certificate

active

07439624

ABSTRACT:
The present invention provides an enhanced interconnect structure with improved reliability. The inventive interconnect structure has enhanced mechanical strength of via contacts provided by embedded metal liners. The embedded metal liners may be continuous or discontinuous. Discontinuous embedded metal liners are provided by a discontinuous interface at the bottom of the via located within the interlayer dielectric layer.

REFERENCES:
patent: 5098860 (1992-03-01), Chakravorty et al.
patent: 5930669 (1999-07-01), Uzoh
patent: 5933753 (1999-08-01), Simon et al.
patent: 6258707 (2001-07-01), Uzoh
patent: 6383920 (2002-05-01), Wang et al.
patent: 6429519 (2002-08-01), Uzoh
patent: 6498091 (2002-12-01), Chen et al.
patent: 2002/0171147 (2002-11-01), Yew et al.
patent: 2003/0134510 (2003-07-01), Lee et al.
patent: 2006/0043588 (2006-03-01), Streck et al.
Pending U.S. Appl. No. 10/964,882, filed Oct. 14, 2004, “Modified via Bottom Structure for Reliability Enhancement”.

Affiliated with

Also associated with

Rating

Enhanced mechanical strength via contacts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced mechanical strength via contacts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced mechanical strength via contacts will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4010985