Encapsulated electronic component having a plurality of connecti

Details Encapsulated electronic component having a plurality of connecti Encapsulated electronic component having a plurality of connecti

1996-04-25

1998-04-28

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257770, 257666, H01L 2348, H01L 2352, H01L 2940

Patent

active

057448680

ABSTRACT:
An encapsulated electronic component containing a plurality of connection leads and an outer case, where the connection leads extend externally to the outer case and contain martensitic structural-hardening conductive alloy.

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Patent Abstracts of Japan, vol. 95, No. 7, Aug. 31, 1995 and JP-A-07 102324, Apr. 18, 1995.

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