Flip chip adaptor package for bare die
Flip-chip device having conductive connectors
Fluorine depleted adhesion layer for metal interconnect...
Fluted via formation for superior metal step coverage
Formation of aligned capped metal lines and interconnections...
Forming ultra dense 3-D interconnect structures
GaAs integrated circuit device and method of attaching same
Gate stack structure
Graded low-k middle-etch stop layer for dual-inlaid patterning
Grid array electronic component, wire reinforcing method for...
Hermetically sealed metal stem or header for semiconductor devic
High aspect ratio fill method and resulting structure
High aspect ratio metallization structures
High aspect ratio metallization structures
High density integrated circuit packaging with chip stacking and
High density integrated circuit packaging with chip stacking...
High density integrated circuits using tapered and...
High density multi-level metallization and interconnection struc
High density wire bonding pads for semiconductor package
High force metal plated spring structure