Grid array electronic component, wire reinforcing method for...

Details Grid array electronic component, wire reinforcing method for... Grid array electronic component, wire reinforcing method for...

2006-02-14

2006-02-14

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S774000, C257S786000, C257S738000

Reexamination Certificate

active

06998715

ABSTRACT:
Grid array electronic component, wiring-strengthening method and producing method wherein a grid array electronic component in which a grid array LSI chip2having a large number of lands3connected to a large number of lands13through connecting means30, the lands13are connected to a wire4of a printed wiring board1, an auxiliary land5is formed at a connection portion31of the lands13on the printed wiring board1corresponding to the lands3of a corner portion of the grid array LSI chip2connecting the wire4and the concentration of stress of the connection portion31is moderated, thereby providing the effect that the brake of the wire in the connection portion31is prevented.

REFERENCES:
patent: 5784262 (1998-07-01), Sherman
patent: 5815374 (1998-09-01), Howell
patent: 6091155 (2000-07-01), Jonaidi
patent: 6218630 (2001-04-01), Takigami
patent: 8-78825 (1996-03-01), None
patent: 11-97575 (1999-04-01), None

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