High density multi-level metallization and interconnection struc

Details High density multi-level metallization and interconnection struc High density multi-level metallization and interconnection struc

1996-02-14

1997-04-08

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257763, 257768, 257760, 257900, H01L 2348, H01L 2944, H01L 2952, H01L 2962

Patent

active

056190727

ABSTRACT:
Increased densification in a semiconductor chip is provided by a negative enclosure of a conductive via utilizing an etch stop insulating material.

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"Silicon Processing for the VLSI Era," Wolf, Lattice Press, 1990, vol. 2, pp. 124-128, 192-199, 212-217, 229-233, 268-273.

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