Flip-chip device having conductive connectors

Details Flip-chip device having conductive connectors Flip-chip device having conductive connectors

2006-08-08

2006-08-08

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S737000, C257S783000

Reexamination Certificate

active

07088004

ABSTRACT:
Semiconductor devices having a passivation layer formed over their major electrodes and individual electrical connectors connected to the electrodes by conductive attach material through openings in the passivation layer are described.

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patent: 6337445 (2002-01-01), Abbott et al.
patent: WO 01/75961 (2001-10-01), None

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