Hermetically sealed metal stem or header for semiconductor devic

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Patent

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Details

257784, 257739, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053213076

ABSTRACT:
In a stem for a semiconductor device comprising a flat metal plate, a lead and a sealing glass portion, an inner surface of a through-hole made in the flat metal plate is provided with irregularities. Percent defective regarding airtightness on welding for cap sealing and stem fixing is remarkably improved.

REFERENCES:
patent: 3436109 (1969-04-01), Loose
patent: 3970235 (1976-07-01), Blust

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