LandOfFree - US Patents - Listing for Thermal measuring and testing,Leak or flaw detection,With heating or cooling of specimen for test

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Apparatus for inspecting bump junction of flip chips and method

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Apparatus for inspecting bump junction of flip chips and method

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Bond inspection technique for a semiconductor chip

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Bonding strength measuring device

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Contactless testing of electronic materials and devices using mi

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Crack sizing

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Detection of broken coated fuel particles in ceramic coating lay

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Detection of defects by thermographic analysis

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Detection of defects by thermographic analysis

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Device and method for non-contact detection of structural...

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Ebulliometric hot spot detector

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Evaluating both thickness and compositional variables in a thin

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Flip chip defect analysis using liquid crystal

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Identifying defects in a conductive structure of a wafer,...

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Infrared NDI for detecting shallow irregularities

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Junction inspection method and apparatus for electronic parts

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Liquified nitrogen thermal checking of electronic circuitry

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Method and an apparatus for flaw detection

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

Method and apparatus for detecting asperities on magnetic disks