Junction inspection method and apparatus for electronic parts

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

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Details

374124, 374137, 228105, G01N 2572, G01N 2171

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active

050528165

ABSTRACT:
A plurality of lead wires such as those from an IC (an integrated circuit) is irradiated by a fan beam at same time. Infrared rays radiated from the portion which is irradiated by the fan beam and the periphery of the portion are detected so as to catch a thermogram exhibiting the temperature distribution. The thermogram is processed by image processing so as to produce a temperature distribution image. This image is visually compared with a standard temperature distribution-pattern on a display apparatus to judge whether soldering on those lead wires is defective or not.

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R. Vanzetti et al., "Laser Inspection of Solder Joints" Conference: CECON 80, 1980 Cleveland Electrical/Electronics Conference, Cleveland, Ohio, USA (20-22 May 1980), pp. 103-108.
Sechi et al., "Computer-Controlled Infrared, Microscope for Thermal Analysis of Microwave Transistors", 1977 IEEE MTT S International Microwave Symposium Diget, pp. 143-146.
McLaughlin et al., "Non-Destructive Examination of Fibre Composite NDT International", Apr. 1980, pp. 56-62.

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