Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Reexamination Certificate
2005-12-06
2005-12-06
Verbitsky, Gail (Department: 2859)
Thermal measuring and testing
Leak or flaw detection
With heating or cooling of specimen for test
C374S045000, C374S057000, C324S765010, C324S754120, C324S754120
Reexamination Certificate
active
06971791
ABSTRACT:
Heat is applied to a conductive structure that includes one or more vias, and the temperature at or near the point of heat application is measured. The measured temperature indicates the integrity or the defectiveness of various features (e.g. vias and/or traces) in the conductive structure, near the point of heat application. Specifically, a higher temperature measurement (as compared to a measurement in a reference structure) indicates a reduced heat transfer from the point of heat application, and therefore indicates a defect. The reference structure can be in the same die as the conductive structure (e.g. to provide a baseline) or outside the die but in the same wafer (e.g. in a test structure) or outside the wafer (e.g. in a reference wafer), depending on the embodiment.
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Borden Peter G.
Li Ji-Ping
Boxer Cross, INC
Silicon Valley Patent & Group LLP
Verbitsky Gail
LandOfFree
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