4. Thermal measuring and testing
  5. Leak or flaw detection
  6. With heating or cooling of specimen for test
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Bond inspection technique for a semiconductor chip

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Patent

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Bonding strength measuring device

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Reexamination Certificate

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