Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Patent
1992-06-01
1993-09-21
Cuchlinski, Jr., William A.
Thermal measuring and testing
Leak or flaw detection
With heating or cooling of specimen for test
374124, 374137, 228104, G01N 2518
Patent
active
052462919
ABSTRACT:
A bond inspection technique which determines the integrity of a plurality of package leads (13) bonded to a plurality of contact areas (12) on a semiconductor chip (11). A bonding process heats each package lead (13) bonded to each contact area (12). A camera (16) forms an infra-red intensity image at a predetermined time of the semiconductor chip (11) and ports image data to a computer (18). Infra-red intensity radiated from each bond on the semiconductor chip (11) is compared by the computer (18) with infra-red intensity data of known good and bad bonds. The comparison of each bond determines bond integrity of the semiconductor chip (11).
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patent: 4792683 (1988-12-01), Chang et al.
patent: 4999499 (1991-03-01), Bhatt
patent: 5052816 (1991-10-01), Nakamura et al.
patent: 5064291 (1991-11-01), Reiser
Lebeau Christopher J.
Ogden Paul A.
Wang Shay-Ping T.
Barbee Joe E.
Cuchlinski Jr. William A.
Motorola Inc.
Worth W. Morris
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