Bond inspection technique for a semiconductor chip

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

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374124, 374137, 228104, G01N 2518

Patent

active

052462919

ABSTRACT:
A bond inspection technique which determines the integrity of a plurality of package leads (13) bonded to a plurality of contact areas (12) on a semiconductor chip (11). A bonding process heats each package lead (13) bonded to each contact area (12). A camera (16) forms an infra-red intensity image at a predetermined time of the semiconductor chip (11) and ports image data to a computer (18). Infra-red intensity radiated from each bond on the semiconductor chip (11) is compared by the computer (18) with infra-red intensity data of known good and bad bonds. The comparison of each bond determines bond integrity of the semiconductor chip (11).

REFERENCES:
patent: 3803413 (1974-04-01), Vanzetti et al.
patent: 4792683 (1988-12-01), Chang et al.
patent: 4999499 (1991-03-01), Bhatt
patent: 5052816 (1991-10-01), Nakamura et al.
patent: 5064291 (1991-11-01), Reiser

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