4. Thermal measuring and testing
  5. Leak or flaw detection
  6. With heating or cooling of specimen for test
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Apparatus for evaluating thermal and electrical characteristics

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Patent

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Apparatus for inspecting bump junction of flip chips and method

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Patent

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Apparatus for inspecting bump junction of flip chips and method

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Patent

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