Ebulliometric hot spot detector

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test

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324 52, 324 73PC, 324158R, G01N 2572

Patent

active

044667469

ABSTRACT:
An ebulliometric hot spot detector detects hot spots with a resolution of the order of a micron on semiconductor devices. The device to be tested is operated in a suitable liquid contained in the detector, and the liquid pressure is decreased until boiling from sites on the device is observed. The liquid pressure is then increased until boiling ceases; meanwhile, the boiling sites on the device are observed. Small bubbles observed just before cessation of boiling pinpoint the hot spot locations. The pressure at which boiling ceases in a given liquid determines the hot spot temperature.

REFERENCES:
patent: 2578265 (1951-12-01), Saalfrank
patent: 3361037 (1968-01-01), Likavec
patent: 3396335 (1968-08-01), Burr et al.
patent: 3510762 (1970-05-01), Leslie
Blackburn, D. L., "An Electrical Technique for the Measurement of the Peak Junction Temperature of Power Transistors," Proc. IEEE 13th Annual Conf. on Reliability Physics (1975), pp. 142-150.
Brenner, D. J., "A Technique for Measuring the Surface Temperature of Transistors by Means of Fluorescent Phosphor," N.B.S. Technical Note 591 (1971), pp. 1-46.
Anon., "Determining Hot Spots, Temperatures on IC Chips," Circuits Manufacturing (Sep. 1976).
Dandon, G. P., "A Cheap Way to Detect Failure Sites on LSI Devices Using Fluorocarbon," Semiconductor International '80, Brighton, Eng. (1980) (Abstract).
Cole, R., "Homogeneous and Heterogeneous Nucleation," In: Van Stralen, S. and Cole, R., Boiling Phenomena, N.Y., McGraw-Hill, 1979, vol. I, pp. 71-73.

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