Apparatus for inspecting bump junction of flip chips and method

Details Apparatus for inspecting bump junction of flip chips and method Apparatus for inspecting bump junction of flip chips and method

1996-12-16

1999-11-16

Gibson, Randy W.

Thermal measuring and testing

Leak or flaw detection

With heating or cooling of specimen for test

25055934, 438 15, 29 2501, G01N 2572, G01J 500

Patent

active

059845228

ABSTRACT:
An apparatus for inspecting bump junctions in a semiconductor flip chip mounting which is able to inspect a state of a junction portion, has a simple structure and is safe and suitable for mass production of semiconductor devices and a method of inspecting the same; in an apparatus for inspecting bump junction in semiconductor flip chip mounting in which a semiconductor bare chip is mounted reversely on a substrate through the bumps, the surface of the semiconductor bare chip is irradiated with a laser light and radiation heat from the heated chip is detected with an infrared camera, a computer acquires temperature distribution on the chip surface from a picture processing unit and analyzes the temperature distribution, thereby to decide the quality of the bump junction state, and decision processing is performed by acquiring data of temperature distribution from a reference semiconductor device of known excellent quality in advance by the same method and comparing with these data.

REFERENCES:
patent: 5052816 (1991-10-01), Nakamura et al.
patent: 5111048 (1992-05-01), Devitt et al.
patent: 5250809 (1993-10-01), Nakata et al.
patent: 5473259 (1995-12-01), Takeda

Affiliated with

Also associated with

Rating

Apparatus for inspecting bump junction of flip chips and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for inspecting bump junction of flip chips and method , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for inspecting bump junction of flip chips and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1315509