Underfilling process in a molded matrix array package using...
Underlayer film for copper, and a semiconductor device...
Underlayer for high performance magnetic tunneling junction...
Underlayer liner for copper damascene in low k dielectric
Underlayer process for high O.sub.3 /TEOS interlayer dielectric
Underlayer protection for the dual damascene etching
Undoped and fluorinated amorphous carbon film as pattern...
Undoped gate poly integration for improved gate patterning...
Undoped silicon dioxide as etch mask for patterning of doped...
Undoped silicon dioxide as etch stop for selective etch of...
Undulated moat for reducing contact resistance
Uniaxial strain relaxation of biaxial-strained thin films...
Unidirectionally conductive materials for interconnection
Uniform contact
Uniform current density and high current gain bipolar transistor
Uniform current distribution SCR device for high voltage ESD...
Uniform dielectric film deposition on textured surfaces
Uniform dielectric layer and method to form same
Uniform distribution of reactants in a device layer
Uniform dopant distribution for mesas of semiconductors