Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2006-12-19
2006-12-19
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257SE23123
Reexamination Certificate
active
07151014
ABSTRACT:
Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By separating the top flow front and the bottom flow front, this process prevents the top flow front from wrapping around the sides of the substrates and trapping air below each substrate and in front of the bottom flow front.
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Chee Choong Kooi
Krishnan Saravanan
Manepalli Rahul N.
Blakely , Sokoloff, Taylor & Zafman LLP
Dolan Jennifer M
Jr. Carl Whitehead
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