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Thin films and methods of making them

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
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Thin films for magnetic device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Thin flip—chip method

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Thin flip-chip method

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Thin flip-chip method

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Thin flip-chip method

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Thin floating gate and conductive select gate in situ doped...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Thin gate dielectric for a CMOS transistor and method of...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Thin gate electrode CMOS devices and methods of fabricating...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Thin germanium oxynitride gate dielectric for...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Thin handle substrate method and structure for fabricating...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
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Thin handle substrate method and structure for fabricating...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
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Thin handle substrate method and structure for fabricating...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
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Thin interface layer to improve copper etch stop

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Thin layer element and associated fabrication process

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
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Thin layer semi-conductor structure comprising a heat...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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Thin leadless plastic chip carrier

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Thin liquid crystal transducer pixel cell having self-aligned su

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Ordered or disordered
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Thin metal oxide film and process for producing the same

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
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Thin microelectronic substrates and methods of manufacture

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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