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Recovery of hydrophobicity of low-k and ultra low-k...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Recovery of surface-ready silicon carbide substrates

Semiconductor device manufacturing: process – Repair or restoration
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Recovery processing method of an electrode

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Recovery processing method to be adopted in substrate...

Semiconductor device manufacturing: process – Including control responsive to sensed condition
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Recrystallization method of polysilicon film in thin film...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
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Rectangular contact used as a low voltage fuse element

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Rectangular contact used as a low voltage fuse element

Semiconductor device manufacturing: process – Direct application of electrical current – To alter conductivity of fuse or antifuse element
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Rectangular-shaped controlled collapse chip connection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Recycling a wafer comprising a buffer layer, after having...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Recycling by mechanical means of a wafer comprising a...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Recycling by mechanical means of a wafer comprising a...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Recycling faulty multi-die packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Recycling of a wafer comprising a buffer layer after having...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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Recycling of a wafer comprising a multi-layer structure...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
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Red and blue stacked laser diode array by wafer fusion

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Making emissive array
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Red light-emitting device and method for preparing the same

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
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Redistributed bond pads in stacked integrated circuit die...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Redistribution layer of wafer and the fabricating method...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Redistribution layer with microstrips

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Redistribution of copper deposited films

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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