Rectangular-shaped controlled collapse chip connection

Details Rectangular-shaped controlled collapse chip connection Rectangular-shaped controlled collapse chip connection

2008-05-05

2010-06-29

Trinh, Hoa B (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S612000, C257SE21111, C716S030000

Reexamination Certificate

active

07745256

ABSTRACT:
A rectangular-shaped controlled collapse chip connection (C4) is described. In one embodiment, there is a semiconductor chip package that comprises a semiconductor chip package substrate and a semiconductor chip having a plurality of rectangular-shaped C4contacts attached thereto that connect the semiconductor chip to the semiconductor chip package substrate. The plurality of rectangular-shaped C4contacts are arranged along a surface of the semiconductor chip in an orientation that extends radially from a center of the surface of the semiconductor chip.

REFERENCES:
patent: 6238948 (2001-05-01), Ramalingam
patent: 6635960 (2003-10-01), Farrar
patent: 2008/0181558 (2008-07-01), Hartwell et al.

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