Recycling a wafer comprising a buffer layer, after having...

Details Recycling a wafer comprising a buffer layer, after having... Recycling a wafer comprising a buffer layer, after having...

2006-03-07

2006-03-07

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S458000, C438S406000

Reexamination Certificate

active

07008857

ABSTRACT:
A method of recycling a donor wafer after detaching at least one useful layer is provided, the donor wafer comprising successively a substrate, a buffer structure and, before detachment, a useful layer. The method includes removal of substance relating to part of the donor wafer on the side where the detachment took place, such that, after removal of substance, there remains at least part of the buffer structure capable of being reused as at least part of a buffer structure during a subsequent detachment of a useful layer. The present document also relates to a method of producing a donor wafer which can be recycled according to the invention, methods of detaching a thin layer from a donor wafer which can be recycled according to the invention, and donor wafers which can be recycled according to the invention.

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