Recycling faulty multi-die packages

Details Recycling faulty multi-die packages Recycling faulty multi-die packages

2011-06-21

2011-06-21

Dang, Phuc T (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S109000, C438S110000, C365S185110, C365S185180

Reexamination Certificate

active

07964445

ABSTRACT:
The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.

REFERENCES:
patent: 5953265 (1999-09-01), Walton et al.
patent: 6262926 (2001-07-01), Nakai
patent: 6434044 (2002-08-01), Gongwer et al.
patent: 6956769 (2005-10-01), Lee
patent: 6976194 (2005-12-01), Cypher
patent: 7236423 (2007-06-01), Sohn et al.
patent: 7308524 (2007-12-01), Grundy et al.
patent: 2006/0097284 (2006-05-01), Ronen
Korean Office Action dated Aug. 31, 2009 in Korean Patent Application No. 10-2008-7016960.
Response to Korean Office Action filed Oct. 23, 2009 in Korean Patent Application No. 10-2008-7016960.

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