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Removal of charged defects from metal oxide-gate stacks

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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Removal of CMP and post-CMP residue from semiconductors...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Removal of CMP residue from semiconductor substrate using...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Removal of CMP residue from semiconductors using...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Removal of copper oxides from integrated interconnects

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Removal of copper oxides from integrated interconnects

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Removal of dielectric oxides

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Removal of inorganic anti-reflective coating using fluorine etch

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent

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Removal of integrated circuits from packages

Semiconductor device manufacturing: process – Repair or restoration
Reexamination Certificate

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Removal of MEMS sacrificial layers using supercritical...

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
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Removal of metal contaminants from the surface of a silicon...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Gettering of semiconductor substrate
Reexamination Certificate

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Removal of metal cusp for improved contact fill

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Removal of metal cusp for improved contact fill

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Removal of metal veils from via holes

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Removal of organic anti-reflection coatings in integrated...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Diffusing a dopant
Reexamination Certificate

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Removal of organic material in integrated circuit...

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate

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Removal of polishing residue from substrate using...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Removal of post etch residuals on wafer surface

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Removal of residue from a substrate

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Removal of silicon oxide

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Patent

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