Removal of residue from a substrate

Details Removal of residue from a substrate Removal of residue from a substrate

2005-01-11

2005-01-11

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S672000, C438S693000, C438S906000

Reexamination Certificate

active

06841470

ABSTRACT:
A method and an apparatus of removing a particle from a metal plug on a substrate is disclosed. The method comprises introducing a slurry onto the metal layer and polishing the metal layer. A solution comprising hydrogen peroxide is introduced onto the metal plug and at least one particle is removed from the metal plug.

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