Removal of integrated circuits from packages

Details Removal of integrated circuits from packages Removal of integrated circuits from packages

2011-07-19

2011-07-19

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Repair or restoration

C438S014000, C438S015000, C438S016000, C438S017000, C438S018000, C257S734000, C257S735000, C257S736000, C257S737000, C257S738000

Reexamination Certificate

active

07981698

ABSTRACT:
Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die approximately simultaneously.

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