Removal of organic material in integrated circuit...

Details Removal of organic material in integrated circuit... Removal of organic material in integrated circuit...

2005-03-15

2005-03-15

Vinh, Lan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S750000, C438S753000, C134S001100, C134S001200

Reexamination Certificate

active

06867148

ABSTRACT:
Organic acid components are used to increase the solubility of ozone in aqueous solutions for use in removing organic materials, such as polymeric resist and/or post-etch residues, from the surface of an integrated circuit device during fabrication. Each organic acid component is preferably chosen for its metal-passivating effect. Such solutions can have significantly lower corrosion rates when compared to ozonated aqueous solutions using common inorganic acids for ozone solubility enhancement due to the passivating effect of the organic acid component.

REFERENCES:
patent: 4287002 (1981-09-01), Torok
patent: 4899767 (1990-02-01), McConnell et al.
patent: 4917123 (1990-04-01), McConnell et al.
patent: 5087951 (1992-02-01), Chance et al.
patent: 5762779 (1998-06-01), Shirmizu et al.
patent: 5785875 (1998-07-01), Hawthorne et al.
patent: 5833871 (1998-11-01), Matsushita et al.
patent: 5911837 (1999-06-01), Matthews
patent: 5939336 (1999-08-01), Yates
patent: 5972236 (1999-10-01), Tanaka et al.
patent: 6012469 (2000-01-01), Li et al.
patent: 6017827 (2000-01-01), Morgan et al.
patent: 6032682 (2000-03-01), Verhaverbeke
patent: 6076229 (2000-06-01), Berglund
patent: 6080531 (2000-06-01), Carter et al.
patent: 6090721 (2000-07-01), Yates
patent: 6103680 (2000-08-01), Honda et al.
patent: 6117351 (2000-09-01), Li et al.
patent: 6127279 (2000-10-01), Konuma
patent: 6136767 (2000-10-01), Hineman et al.
patent: 6146467 (2000-11-01), Takaishi et al.
patent: 6162738 (2000-12-01), Chen et al.
patent: 6192889 (2001-02-01), Li et al.
patent: 6230720 (2001-05-01), Yalamanchili et al.
patent: 6277203 (2001-08-01), Jiang et al.
patent: 6319801 (2001-11-01), Wake et al.
patent: 6323169 (2001-11-01), Abe et al.
patent: 6360756 (2002-03-01), Chen et al.
patent: 6372150 (2002-04-01), Wong et al.
patent: 6383724 (2002-05-01), Carter et al.
patent: 361004232 (1986-01-01), None

Affiliated with

Also associated with

Rating

Removal of organic material in integrated circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Removal of organic material in integrated circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Removal of organic material in integrated circuit... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3436395