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Reduced metal pipe formation in metal silicide contacts

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Reduced pad erosion

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent

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Reduced parasitic leakage in semiconductor devices

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent

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Reduced particulate etching

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Reduced power magnetoresistive random access memory elements

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component
Reexamination Certificate

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Reduced RC delay between adjacent substrate wiring lines

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Reduced RC delay between adjacent substrate wiring lines

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having air-gap dielectric
Reexamination Certificate

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Reduced silicon gouging and common source line resistance in...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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Reduced size etching method for integrated circuits

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent

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Reduced size printhead for an inkjet printer

Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead
Patent

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Reduced splattering of unpassivated laser fuses

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Reduced stress isolation for SOI devices and a method for...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
Reexamination Certificate

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Reduced stress LOC assembly

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Reduced stress LOC assembly

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Reduced substrate capacitance high performance SOI process

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

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Reduced surface charging in silicon-based devices

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate

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Reduced surface charging in silicon-based devices

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate

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Reduced surface field device having an extended field plate...

Semiconductor device manufacturing: process – Making regenerative-type switching device – Having structure increasing breakdown voltage
Reexamination Certificate

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Reduced temperature contact/via filling

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Reduced terminal testing system

Semiconductor device manufacturing: process – With measuring or testing
Patent

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