Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead
Patent
1999-11-03
2000-11-14
Smith, Matthew
Semiconductor device manufacturing: process
Manufacture of electrical device controlled printhead
346 11, 346140R, 205 75, H01L 2100
Patent
active
061469157
ABSTRACT:
A printhead for an inkjet print cartridge capable of generating low drop weight ink drops is produced by reducing the dimensions of the firing chamber. A thinner orifice plate is needed to reliably achieve the lower drop weight ink drops. To overcome the material strength limitations of such a thinner orifice plate, an annealing step in the manufacture of the printhead is employed to modify the material properties of the orifice plate. This improved process improves the print quality of printers and aids in the production handling properties of the orifice plate. Orifice plates having a thickness in the range of 25 .mu.m to 40 .mu.m are being produced.
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Boyd Patrick V.
Kasperchik Vladek P.
Kraus Gerald T.
MacLeod Cheryl A.
Pidwerbecki David
Hewlett--Packard Company
Rocchegiani Renzo N.
Smith Matthew
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