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Bare chip mounting method and bare chip mounting system

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Barium strontium titanate annealing process

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
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Barrier and electroplating seed layer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier applications for aluminum planarization

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier applications for aluminum planarization

Semiconductor device manufacturing: process – Including control responsive to sensed condition
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Barrier coatings produced by atmospheric glow discharge

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor
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Barrier enhancement

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier film integrity on porous low k dielectrics by...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier film integrity on porous low k dielectrics by...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier first method for single damascene trench applications

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier for copper metallization

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier for use in 3-D integration of circuits

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier for use in 3-D integration of circuits

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier formation using novel sputter deposition method with...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier free copper interconnect by multi-layer copper seed

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier in gate stack for improved gate dielectric integrity

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
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Barrier in gate stack for improved gate dielectric integrity

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
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Barrier layer and a method for suppressing diffusion...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier layer and fabrication method thereof

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
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Barrier layer buffing after Cu CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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