Ball grid array package and fabrication method therefor

Details Ball grid array package and fabrication method therefor Ball grid array package and fabrication method therefor

1998-02-13

1999-07-13

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438106, 438127, 257738, 361764, H01L 2144, H01L 2148

Patent

active

059239549

ABSTRACT:
A BGA package and a fabrication method therefor are capable of enhancing the productivity of an assembly by eliminating a wire bonding step, which requires a significant amount of time. The package includes a semiconductor chip, connection balls attached to upper surfaces of each of a plurality of chip pads formed on an upper surface of the semiconductor chip, a molding section that exposes upper portions of the connection balls and that packages at least a portion of the semiconductor chip, and solder balls attached to the exposed surfaces of the connection balls. A BGA package embodying the invention is lighter and more compact than related BGA packages. Also, because a wire bonding process is not necessary, it is less expensive to manufacture a BGA package embodying the invention.

REFERENCES:
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5598036 (1997-01-01), Ho
patent: 5726079 (1998-03-01), Johnson et al.
patent: 5737191 (1998-04-01), Horiuchi et al.
patent: 5767575 (1998-06-01), Lan et al.
patent: 5861322 (1999-01-01), Caillat et al.
patent: 5863814 (1999-01-01), Alcoe et al.
patent: 5866953 (1999-01-01), Akram et al.

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