Ball grid array (BGA) encapsulation mold

Details Ball grid array (BGA) encapsulation mold Ball grid array (BGA) encapsulation mold

1997-07-23

1999-07-13

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438106, 438125, H01L 2144, H01L 2148, H01L 2150

Patent

active

059239590

ABSTRACT:
A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.

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