Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2005-11-21
2009-10-27
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257SE21502
Reexamination Certificate
active
07608487
ABSTRACT:
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin system comprising an epoxy resin, a phenol-containing compound such as phenol or phenolic resin, a solvent, an imidazole phosphate salt catalyst, inorganic fillers, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.
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Dutt Gyanendra
Ma Bodan
Tong Quinn K.
Xiao Allison Yue
Henkel AG & Co. KGaA
Zarneke David A
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