B-stageable die attach adhesives

Details B-stageable die attach adhesives B-stageable die attach adhesives

2007-02-09

2010-12-14

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

07851254

ABSTRACT:
The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

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