Balance filter packaging chip having balun mounted therein...

Details Balance filter packaging chip having balun mounted therein... Balance filter packaging chip having balun mounted therein...

2008-03-11

2008-03-11

Gurley, Lynne (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S678000, C257S723000, C257S724000

Reexamination Certificate

active

07341888

ABSTRACT:
A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

REFERENCES:
patent: 2003/0168716 (2003-09-01), Lee et al.
patent: 2005/0184831 (2005-08-01), Yasuda et al.

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