Clad plate for forming interposer for semiconductor device,...

Clip-type lead frame for source mounted die

Clipless and wireless semiconductor die package and method...

Coated thermal interface in integrated circuit die

COF packaged semiconductor

COF packaging structure, method of manufacturing the COF...

Column ball grid array package

Compact co-packaged semiconductor dies with...

Compact semiconductor package with integrated bypass...

Compact system module with built-in thermoelectric cooling

Composite lid for land grid array (LGA) flip-chip package...

Connection leads for an electronic component

Connection technology for power semiconductors comprising a...

Cooling micro-channels

Cooling of optoelectronic elements

Cooling system for a semiconductor device and method of...

Coreless substrate

Device and method for making devices comprising at least a...

Device for sealing and cooling multi-chip modules

Diamond heat spreading and cooling technique for integrated...