Connection technology for power semiconductors comprising a...

Details Connection technology for power semiconductors comprising a... Connection technology for power semiconductors comprising a...

2007-04-24

2007-04-24

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S126000, C438S612000, C257SE23020, C257SE23021, C257SE23023

Reexamination Certificate

active

10547173

ABSTRACT:
A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

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