Connection leads for an electronic component

Details Connection leads for an electronic component Connection leads for an electronic component

1998-01-12

1999-03-30

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438121, H01L 2144, H01L 2148, H01L 2150

Patent

active

058888489

ABSTRACT:
Martensitic or austenitic structural-hardening conductive alloy connection leads. Electronic component and fabrication process.

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