Diamond heat spreading and cooling technique for integrated...

Details Diamond heat spreading and cooling technique for integrated... Diamond heat spreading and cooling technique for integrated...

2006-11-07

2006-11-07

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S108000, C438S105000

Reexamination Certificate

active

07132313

ABSTRACT:
A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.

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