COF packaging structure, method of manufacturing the COF...

Details COF packaging structure, method of manufacturing the COF... COF packaging structure, method of manufacturing the COF...

2011-03-15

2011-03-15

Thomas, Tom (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21521, C257SE21003, C257SE23012

Reexamination Certificate

active

07906374

ABSTRACT:
A COF packaging structure includes a substrate, a first conductive foil, and a second conductive foil. The substrate has a first surface and a second surface opposite to the first surface. The first conductive foil is disposed on the first surface of the substrate and has a first designated pattern for bump bonding. The second conductive foil is disposed on the second surface of the substrate and has a second designated pattern, wherein the area of the second designated pattern is not smaller than the area of the first designated pattern.

REFERENCES:
patent: 2006/0170092 (2006-08-01), Kim et al.
patent: 2004207550 (2004-07-01), None
patent: P2004214430 (2004-07-01), None
patent: 1020060119937 (2006-11-01), None
patent: 2005027221 (2005-03-01), None

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