Clip-type lead frame for source mounted die

Details Clip-type lead frame for source mounted die Clip-type lead frame for source mounted die

2005-08-02

2005-08-02

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S110000

Reexamination Certificate

active

06924175

ABSTRACT:
A semiconductor package includes a lead frame having a displaced integral strap which is cupped out of a lead frame plane to provide a nest that receives a semiconductor chip electrically connected to an inner surface of the cupped strap. The semiconductor package further has a housing molded over and encapsulating the semiconductor chip with the frame such that a surface of the semiconductor chip facing away from the cupped strip is flush with or protrudes beyond a bottom of the housing.

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patent: 2001/0053566 (2001-12-01), Stephen

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