Coated thermal interface in integrated circuit die

Details Coated thermal interface in integrated circuit die Coated thermal interface in integrated circuit die

2011-06-07

2011-06-07

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S119000, C257S712000, C257S713000, C257S718000, C257S719000

Reexamination Certificate

active

07955900

ABSTRACT:
Some embodiments of the invention include a coated thermal interface to bond a die with a heat spreader. The coated thermal interface may be used to bond the die with the heat spreader without flux. Other embodiments are described and claimed.

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Shieu, F. S., et al., “Intermetallic Phase Formation and Shear Strength of a Au-In Microjoint”,Thin Solid Films, 346(1), (1999), 125-129.
Office Action Received for Chinese Patent Application No. 200710093649.2, Mailed Dec. 5, 2008, 7 pgs. (English Translation).
Office Action Received for Taiwanese Patent Application No. 96110788, Mailed on Nov. 10, 2010, 8 pages of Taiwanese Office Action and 1 page of English translation of Search Report.

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