Cooling micro-channels

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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Details

C438S108000, C438S109000, C257S276000

Reexamination Certificate

active

07842553

ABSTRACT:
The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or micro-trenches, and a technique for fabricating the same.

REFERENCES:
patent: 4965660 (1990-10-01), Ogihara et al.
patent: 6538330 (2003-03-01), Forbes
patent: 6764759 (2004-07-01), Duvall et al.
patent: 6800948 (2004-10-01), Fan et al.
patent: 7692289 (2010-04-01), Cai et al.
patent: 2003/0020161 (2003-01-01), Saitoh et al.
patent: 2007/0042596 (2007-02-01), McTeer
patent: 402196477 (1990-08-01), None

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