Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-04-27
2010-11-30
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S108000, C438S109000, C257S276000
Reexamination Certificate
active
07842553
ABSTRACT:
The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or micro-trenches, and a technique for fabricating the same.
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Kim Sarah E.
List R. Scott
Myers Alan
Intel Corporation
Landau Matthew C
Mitchell James M
Trop Pruner & Hu P.C.
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