Clipless and wireless semiconductor die package and method...

Details Clipless and wireless semiconductor die package and method... Clipless and wireless semiconductor die package and method...

2006-01-05

2008-05-13

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S111000, C257S666000, C257S673000

Reexamination Certificate

active

07371616

ABSTRACT:
A method for making a semiconductor die package is disclosed. In some embodiments, the method includes using a leadframe structure including at least one lead structure having a lead surface. A semiconductor die having a first surface and a second surface is attached to the leadframe structure. The first surface of the semiconductor die is substantially planar to the lead surface and the second surface of the semiconductor die is coupled to the leadframe structure. A layer of conductive material is formed on the lead surface and the first surface of the semiconductor die to electrically couple the at least one lead structure to the semiconductor die.

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