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Lead-frame method and assembly for interconnecting circuits...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Lead-frame-based semiconductor package and fabrication...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe alteration to direct compound flow into package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe alteration to direct compound flow into package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe alteration to direct compound flow into package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe finger support

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe for an encapsulated optocomponent

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe having contact pads defined by a polymer insulating fi

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Leadframe having secured outer leads, semiconductor device using

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe including corner leads and semiconductor package...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe strip having enhanced testability

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe with encapsulant guide and method for the...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe with enhanced encapsulation adhesion

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe, plastic-encapsulated semiconductor device, and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe, resin-molded semiconductor device including the...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframe-to-plastic lock for IC package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadframes for improved moisture reliability and enhanced...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadless microelectronic package and a method to maximize...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadless package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Leadless package system having external contacts

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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